High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing
نویسندگان
چکیده
Wafer backside processing steps that include high temperature exposure may now be simplified with the use of a thermally resistant adhesive, GenTak 330. Processing at temperatures of 200oC and beyond are accepted to include plasma etching, deposition, and the curing of related polymers, such as BCB. By combining the thermoset properties of GenTak 330 with the dissolution characteristics of GenSolve, there is no need to separate the substrate from the carrier until backside processing is complete. Application and mounting times within 30 minutes, outgassing at <1%, and demount and cleaning in a few hours, qualify this adhesive as an aid to manufacturing.
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تاریخ انتشار 2004